Tungsten copper electrode is a composite metal material that combined with high purity tungsten powder and high conductivity copper of high purity,good plasticity,then preparing by isostatic pressing,high temperature sintering and refined melting process. So it has a good electrical conductivity, low thermal expansion, high temperature but not soften, high strength, high density and high hardness.The main applications of tungsten copper are followings:

1.Resistance welding electrode.
Since tungsten copper  electrodes combines the good performance,high temperature resistance,electric arc ablation,high intensity, good electrical and thermal conductivity of tungsten and copper,and easy to be prepared, so tungsten copper  electrodes are often used to prepare resistance welding electrodes and welding electrodes.

2.Electrical discharge machining(EDM)electrode.
In early stage,EDM electrode was made of copper or graphite electrodes, cheap but the ablation resistance is not good.Tungsten copper electrode has much advantages of high temperature,high temperature strength,good arc ablation resistance,good thermal conductivity and good performance of radiating. So its applications concentrated in EDM electrodes, welding electrode and high voltage discharge electrodes. The characters of EDM electrode are of various specifications,small batch but large amount. As using for preparing EDM Electrode,the tungsten copper material should have as high density, organizational uniformity as possible especially for the elongated rod, tubular and shaped electrodes.

3.The high-voltage discharge electrodes.
The contact material temperature of High-voltage vacuum discharge tube in the workplace would rise from zero to thousands degree in a few seconds.While tungsten copper can provide discharge stable condition because of its ablation resistance, high toughness and good thermal conductivity performance. It’s necessary for tungsten copper alloy to combine its properties of high heat resistance, high electrical and/or thermal conductivity and low thermal expansion in the application fields.

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