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Molybdenum Market - October 15, 2026

Molybdenum market update on October 15, 2026 China’s molybdenum market is overall under pressure and oscillating weakly, where the quotation of molybdenum iron has been adjusted downward by around 1,000 RMB/ton again. In this context, downstream demand has shown no obvious increase for the time being, and market…

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Tungsten Prices Continue to Decline - April 23, 2026

Analysis of Latest Tungsten Market from Chinatungsten Online Tungsten prices continue their downward trend, putting pressure on market confidence and resulting in weak downstream buying interest. Profit-taking and the release of some products adulterated with waste materials have entered the market at lower prices, impacting the spot market.…

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Why Have Tungsten Prices Fallen? - October 15, 2026

Analysis of Latest Tungsten Market from Chinatungsten Online Tungsten prices continued to face downward pressure, with bearish sentiment dominating spot trading. The market has yet to form a unified consensus where the bottom lies. According to data from China Tungsten Online, more than 55% of tungsten concentrate prices…

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Molybdenum Market - October 15, 2026

Molybdenum market update on October 15, 2026 China’s molybdenum market is overall under pressure and oscillating weakly, where the quotation of molybdenum iron has been adjusted downward by around 1,000 RMB/ton again. In this context, downstream demand has shown no obvious increase for the time being, and market…

2,131

Gold Plated Tungsten Bar Price on August 20, 2025

The latest price of 1KG gold plated tungsten bar is USD480.00/PC on August 20, 2025, EXW XIAMEN, CHINA. The basic trading conditions of Tungsten Gold Plated Bar Product name Gold Plated Tungsten Bar Details Type: 1KG Formal contract quantity: 5pcs Quotation: USD480.00/pc Payment term: 100% T/T in Advance…

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Gold Plated Tungsten Bar Price on August 20, 2025

The latest price of 1KG gold plated tungsten bar is USD480.00/PC on August 20, 2025, EXW XIAMEN, CHINA. The basic trading conditions of Tungsten Gold Plated Bar Product name Gold Plated Tungsten Bar Details Type: 1KG Formal contract quantity: 5pcs Quotation: USD480.00/pc Payment term: 100% T/T in Advance…

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Yttrium-doped Molybdenum Ribbon Price on August 20, 2025

The latest price of 3.0x0.027mm yttrium-doped molybdenum ribbon is USD1.50/kg on August 20, 2025, EXW XIAMEN, CHINA. The basic trading conditions of Yttrium-doped Molybdenum Ribbon Product name Yttrium-doped Molybdenum Ribbon Details Dimension: 3.0x0.027mm Formal contract quantity: 2kgs Quotation: USD1.50/kg Payment term: 100% T/T in Advance Delivery time: in…


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Properties And Uses Of Molybdenum-Containing Stainless Steel

In our lives, stainless steel can be said to be everywhere, from pots and pans in kitchen utensils to instruments in industrial production, etc., there are countless feelings. However, how does the performance and use of molybdenum change after adding it to stainless steel? The molybdenum-containing stainless steel…

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Why Does High-Temperature Creep Cause Stranded Tungsten Heating Elements to Fail?

High-temperature creep refers to the phenomenon in which a metal material gradually undergoes permanent deformation over time under sustained stress, even if the stress does not exceed its short-term strength limit. For stranded tungsten heating elements, long-term high-temperature energization causes the tungsten wires to gradually deform under the…

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Why Does High-Temperature Creep Cause Stranded Tungsten Heating Elements to Fail?

High-temperature creep refers to the phenomenon in which a metal material gradually undergoes permanent deformation over time under sustained stress, even if the stress does not exceed its short-term strength limit. For stranded tungsten heating elements, long-term high-temperature energization causes the tungsten wires to gradually deform under the…

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Application Exploration of Molybdenum-Copper Alloy Under 3D Packaging

With the development of integrated circuits towards high performance, miniaturization and high integration, three-dimensional packaging technology has become a mainstream trend in the semiconductor industry. 3D packaging achieves a high-density, high-bandwidth, low-power package structure by stacking multiple chips vertically and utilizing vertical interconnects (e.g., TSVs, through-silicon vias). The…