W90 tungsten copper plate is composed of 90% W and 10% Cu, its density is up to 16.75g/cm3, hardness reaches more than HB260, the bending strength is 1160MPa, the conductivity is 27%IACS and the softening temperature is more than 900℃.
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Owing to W takes up the most of parts, W90 tungsten copper plate is hard, but its toughness and ductility is not so good so that it is not suitable for bending and drawing with large angle. Tungsten copper not only has good conductivity, but also has similar coefficient of expansion with silicon (Si), gallium arsenide (GaAs) and ceramics. What's more, we can adjust properties through tungsten and copper contents controlling.